the circuitboard is continuouslytransported platingin a fxed direction.not limited tothe fixed single plating tank forplating The distance between the plates should becontrolled within 5mm.

2：The board moves n a verticalway:

it can solve the problem ofwater pooleftect on the board sufaceof the horizontal equipment he phenomenon of roller shielding and the problem of bubble eliminationin the blind hole of the lower board surface,and thenon-uniform distance between the anode andcathode of the upper and lower board surfaceand greatly reducethe scratchonthe board surface.

3:Process capacity:
Specially designed Eductormixed flow nozleis usedin the electroplating coppertankto improve the copperion exchange rate, and can effectivelyelectroplating through holes, flling holes and blind holes.

4:Plate surface uniformity:
COv=-5% Range<=4μm

the production lineis surrounded by fuly enclosed PVC movable slidingdoors and the cylinderside extraction method is adopted to remove the gas in the production.

1to 2people across the line can be operated.