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Speed distance high thickness to diameter ratio electroplated copper wire

Equipment characteristics:​ 1:Semi-automatic loading and unloading can be achieved (fully automatic loading and unloading can be realized for appropriateboard surfaces),reducing the burden of manual loading and unloading; 2:The entire line adopts RFlD for cylinder position addressing, ensuring more precise positioning; 3:By utilizing wide-range oscillation and coordinating with high-flow spraying, we achieve no dead zones in spraying on the boardsurface,enhancing the turbulence of the chemica
  • Product Details

  • Equipment characteristics:

    1:Semi-automatic loading and unloading can be achieved (fully automatic loading and unloading can be realized for appropriateboard surfaces),reducing the burden of manual loading and unloading;

    2:The entire line adopts RFlD for cylinder position addressing, ensuring more precise positioning;

    3:By utilizing wide-range oscillation and coordinating with high-flow spraying, we achieve no dead zones in spraying on the boardsurface,enhancing the turbulence of the chemical solution;

    4:The nozzle can be opened and closed, allowing for infinitely adjustable distance from the nozzle to the plate surface, enhancingthe spraying effect (Suyuan invention patent, patent number: 2023234158681);

    5:With the use of insoluble anodes and the unique design of Suyuan for plates with high thickness-to-diameter ratio, it is possibleto achieve a plate with a thickness-to-diameter ratio of 48:1 and a TP value greater than 85%.


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